VS-500 III Batch Vapor Phase Soldering System

Efficient soldering with uniform heat transfer!

For medium-volume production where inline reflow solutions are not required, vapor phase technology is the right choice.
In addition to mass production, it is also suitable for BGA reballing and adhesive curing.
The advantage of vapor phase technology is that no time-consuming thermal profiling is required and each PCB can be soldered with high quality and low inclusions.
The machine design allows soldering even the most complex PCBs up to 500 x 500 x 60 mm (2 kg) with optimal quality.

Further advantages:

Heat transfer occurs through the liquid, so it is much more efficient.
Precise temperature control
Excellent for large and complex boards (500×500 mm)
Reliable, precise repeatability for all soldering types
For lead-free soldering or even curing of adhesives
Extremely low inclusions
Inert gas atmosphere from the working medium
Extremely uniform temperature distribution
No risk of handling errors during the process
Highly efficient cooling system
10 temperature levels
Unique vapor recovery system - significantly reduced liquid consumption
Real-time reflow profile display

Principle of vapor phase soldering

The heating of the PCBs is done by the heat energy released during the phase transition of a heat transfer fluid (Galder) condensing on the PCBs. The fluid used is selected with a desired boiling point suitable for the solder alloy to be soldered.

This allows for very precise temperature control.

Technical Data

Manufacturer: Exmore
Model: VS500III
System type: Offline / Batch vapor phase soldering system
Maximum PCB size: 500 × 500 × 60 mm
Possible boiling points: 200°C, 210°C, 230°C, 240°C, 260°C
Cooling: Integrated high-performance cooler
Maximum load: 2 kg
Average capacity: 5 kg
Dimensions: 830 × 775 × 1140 mm
Power consumption: 7.5 kW/h
Weight: 260 kg
Power supply: 3 × 400 V + N + T / 50 Hz
Year of manufacture: 2016

"Everything from a single source: We will be happy to offer you a suitable bank financing for your project."
komplett-konzept.leasingo.de

You can find more articles - new and used - in our shop!
International shipping costs on request!

Technical data

Manufacturer: Exmore
Model: VS500III
System type: Offline / Batch steam phase soldering system
Maximum PCB size: 500 × 500 × 60 mm
Possible boiling points: 200°C, 210°C, 230°C, 240°C, 260°C
Cooling: Integrated high-performance cooler
Maximum load: 2 kg
Average capacity: 5 kg
Dimensions: 830 × 775 × 1140 mm
Power consumption: 7.5 kW/h
Weight: 260 kg
Power supply: 3 × 400 V + N + T / 50 Hz
Year of manufacture: 2016